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  2. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which cannot be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects.

  3. Liquid phase sintering - Wikipedia

    en.wikipedia.org/wiki/Liquid_phase_sintering

    Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]

  4. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  5. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    The bonding temperature can be lowered using a higher applied pressure and vice versa, considering that high pressure increases the chances of damage to the structural material or the films. [8] The bonding process itself takes place in a vacuum or forming gas environment, e.g. N 2. [10]

  6. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    The decrease of temperature is based on the increase of bonding strength using plasma activation on clean wafer surfaces. Further, the increase is caused by elevation in amount of Si-OH groups, removal of contaminants on the wafer surface, the enhancement of viscous flow of the surface layer and the enhanced diffusivity of water and gas trapped at the interface. [2]

  7. Liquidus and solidus - Wikipedia

    en.wikipedia.org/wiki/Liquidus_and_solidus

    If a gap exists between the solidus and liquidus it is called the freezing range, and within that gap, the substance consists of a mixture of solid and liquid phases (like a slurry). Such is the case, for example, with the olivine ( forsterite - fayalite ) system, which is common in Earth's mantle .

  8. Phase diagram - Wikipedia

    en.wikipedia.org/wiki/Phase_diagram

    A phase diagram in physical chemistry, engineering, mineralogy, and materials science is a type of chart used to show conditions (pressure, temperature, etc.) at which thermodynamically distinct phases (such as solid, liquid or gaseous states) occur and coexist at equilibrium.

  9. Interfacial polymerization - Wikipedia

    en.wikipedia.org/wiki/Interfacial_polymerization

    The most commonly used interfacial polymerization methods fall into 3 broad types of interfaces: liquid-solid interfaces, liquid-liquid interfaces, and liquid-in-liquid emulsion interfaces. [1] In the liquid-liquid and liquid-in-liquid emulsion interfaces, either one or both liquid phases may contain monomers.