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  2. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which cannot be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects.

  3. Liquid phase sintering - Wikipedia

    en.wikipedia.org/wiki/Liquid_phase_sintering

    Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]

  4. Sintering - Wikipedia

    en.wikipedia.org/wiki/Sintering

    Liquid phase sintering is the process of adding an additive to the powder which will melt before the matrix phase. The process of liquid phase sintering has three stages: rearrangement – As the liquid melts capillary action will pull the liquid into pores and also cause grains to rearrange into a more favorable packing arrangement.

  5. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    Diffusion bonding or diffusion welding is a solid-state welding technique used in metalworking, capable of joining similar and dissimilar metals. It operates on the principle of solid-state diffusion, wherein the atoms of two solid, metallic surfaces intersperse themselves over time.

  6. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    The bonding temperature can be lowered using a higher applied pressure and vice versa, considering that high pressure increases the chances of damage to the structural material or the films. [8] The bonding process itself takes place in a vacuum or forming gas environment, e.g. N 2. [10]

  7. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  8. After my oldest of 3 went to college, the house felt ...

    www.aol.com/news/oldest-3-went-college-house...

    Here's how I'm dealing with the transition and including my younger daughters in the process. ... shared a bedroom and formed an unbreakable bond. When the pandemic started, my oldest moved into ...

  9. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .