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The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
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A surface plating of blue gold on karat gold or sterling silver can be achieved by a gold plating of the surface, followed by indium plating, with layer thickness matching the 1:2 atomic ratio. A heat treatment then causes interdiffusion of the metals and formation of the required intermetallic compound.
[3] An example would be an item stamped as "1 ⁄ 40 10kt RGP" meaning that the object is plated with 10kt gold at a thickness that makes weight of the plated layer equal to one-fortieth of the weight of the metal parts of the object. "Double clad" gold-filled sheet is produced with 1 ⁄ 2 the thickness of gold on each
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This page was last edited on 16 November 2024, at 12:16 (UTC).; Text is available under the Creative Commons Attribution-ShareAlike 4.0 License; additional terms may apply.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
AuAl 2 is the most thermally stable species of the Au–Al intermetallic compounds, with a melting point of 1060 °C (see phase diagram), which is similar to the melting point of pure gold. AuAl 2 can react with Au, therefore is often replaced by Au 2 Al, a tan-colored substance, which forms at composition of 93% of Au and 7% of Al by mass.