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Plasma cutting. Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops ...
It is the most abundant form of ordinary matter in the universe, mostly in stars (including the Sun), but also dominating the rarefied intracluster medium and intergalactic medium. [2][3][4][5] Plasma can be artificially generated, for example, by heating a neutral gas or subjecting it to a strong electromagnetic field.
Plasma torch. A plasma torch cutter. A plasma torch (also known as a plasma arc, plasma gun, plasma cutter, or plasmatron) is a device for generating a directed flow of plasma. [1][2][3] The plasma jet can be used for applications including plasma cutting, plasma arc welding, plasma spraying, and plasma gasification for waste disposal. [4]
Plasma electrolytic oxidation (PEO), also known as electrolytic plasma oxidation (EPO) or microarc oxidation (MAO), is an electrochemical surface treatment process for generating oxide coatings on metals. It is similar to anodizing, but it employs higher potentials, so that discharges [1] occur and the resulting plasma modifies the structure of ...
Plasma activation. Plasma activation (or plasma functionalization) is a method of surface modification employing plasma processing, which improves surface adhesion properties of many materials including metals, glass, ceramics, a broad range of polymers and textiles and even natural materials such as wood and seeds.
Such highly active gas with ionized molecules is called plasma, naming the technique. The gas used for plasma nitriding is usually pure nitrogen, since no spontaneous decomposition is needed (as is the case of nitriding with ammonia). There are hot plasmas typified by plasma jets used for metal cutting, welding, cladding or spraying.
HIPIMS generates a high density plasma of the order of 10 13 ions⋅cm −3 [1] containing high fractions of target metal ions. The main ionisation mechanism is electron impact, which is balanced by charge exchange, diffusion, and plasma ejection in flares. The ionisation rates depend on the plasma density.
A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...
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