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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins that can be put on a dual in-line or flat package .
Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder.
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
Depending on the environment, a warning, a fatal exception, or unpredictable behavior will occur if the program attempts to access an array element that is outside the range. In some programming languages , such as C , arrays have a fixed lower bound (zero) and will contain data at each position up to the upper bound (so an array with 5 ...
BGA with an interposer between the integrated circuit die to ball grid array Pentium II: example of an interposer in dark yellow, integrated circuit die to ball grid array chip carrier. An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider ...
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...
A thin small-outline package (TSOP) is a rectangular, thin-bodied component. A Type I TSOP has legs protruding from the width portion of the package. A Type II TSOP has the legs protruding from the length portion of the package. The ICs on DRAM memory modules were usually TSOPs until they were replaced by ball grid array (BGA).
In the C programming language, an ellipsis is used to represent a variable number of parameters to a function.For example: int printf (const char * format,...); [4] The above function in C could then be called with different types and numbers of parameters such as: