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  2. Ultrasonic soldering - Wikipedia

    en.wikipedia.org/wiki/Ultrasonic_soldering

    Ultrasonic soldering is a distinctly different process than ultrasonic welding.Ultrasonic welding uses ultrasonic energy to join parts without adding any kind of filler material while ultrasonic soldering uses external heating to melt filler metal materials, namely solders, to form a joint.

  3. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    High volume production is usually done with a pick-and-place machine and bulk wave soldering for through-hole parts or reflow ovens for SMT components or through-hole parts, but skilled technicians are able to hand-solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) [29] under a microscope, using tweezers and a ...

  4. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board.

  5. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    Solder (UK: / ˈ s ɒ l d ə, ˈ s ə ʊ l d ə /; [1] NA: / ˈ s ɒ d ər /) [2] is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling.

  6. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...

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  9. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

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