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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

  4. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Heat sinks provide a path for heat from the LED source to outside medium. Heat sinks can dissipate power in three ways: conduction (heat transfer from one solid to another), convection (heat transfer from a solid to a moving fluid, which for most LED applications will be air), or radiation (heat transfer from two bodies of different surface temperatures through Thermal radiation).

  5. Sources and sinks - Wikipedia

    en.wikipedia.org/wiki/Sources_and_sinks

    In thermodynamics, the source and sinks correspond to two types of thermal reservoirs, where energy is supplied or extracted, such as heat flux sources or heat sinks. In thermal conduction this is described by the heat equation. [10] The terms are also used in non-equilibrium thermodynamics by introducing the idea of sources and sinks of ...

  6. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    As active heat pumps which consume power, TECs can produce temperatures below ambient, impossible with passive heatsinks, radiator-cooled liquid cooling, and heatpipe HSFs. However, while pumping heat, a Peltier module will typically consume more electric power than the heat amount being pumped.

  7. Electronics cooling - Wikipedia

    en.wikipedia.org/wiki/Electronics_cooling

    Heat sinks are devices that are used to extend the surface area of electronic components available for air cooling, helping to lower the components case temperature. Fans are used to increase the air flow. Thermal design and analysis is performed using hand calculations or spreadsheets, based on design rules or heat transfer correlations.

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