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The relationship between thermal conductance and resistance is analogous to that between electrical conductance and resistance in the domain of electronics. Thermal insulance (R-value) is a measure of a material's resistance to the heat current. It quantifies how effectively a material can resist the transfer of heat through conduction ...
A temperature drop is observed at the interface between the two surfaces in contact. This phenomenon is said to be a result of a thermal contact resistance existing between the contacting surfaces. Thermal contact resistance is defined as the ratio between this temperature drop and the average heat flow across the interface. [1]
Heat is transported by phonons and by free electrons in solids. For pure metals, however, the electronic contributions dominate in the thermal conductivity. [citation needed] In impure metals, the electron mean free path is reduced by collisions with impurities, and the phonon contribution may be comparable with the electronic contribution.
Thermal conduction is the diffusion of thermal energy (heat) within one material or between materials in contact. The higher temperature object has molecules with more kinetic energy ; collisions between molecules distributes this kinetic energy until an object has the same kinetic energy throughout.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
In heat transfer and thermodynamics, a thermodynamic system is said to be in thermal contact with another system if it can exchange energy through the process of heat. Perfect thermal isolation is an idealization as real systems are always in thermal contact with their environment to some extent.
A heat current or thermal current is a kinetic exchange rate between molecules, relative to the material in which the kinesis occurs. It is defined as the net rate of flow of heat . The SI unit of heat current is the watt , which is the flow of heat across a surface at the rate of one Joule per second.
Current is the flow of charged particles through the material and these particles (electrons or holes), interact with the lattice of the crystal losing its energy which is released in form of heat. Joule Heating is a predominant mechanism for heat generation in integrated circuits [ 1 ] and is an undesired effect in most of the cases.