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On August 2, 2022, the CXL Specification 3.0 was released, based on PCIe 6.0 physical interface and PAM-4 coding with double the bandwidth; new features include fabrics capabilities with multi-level switching and multiple device types per port, and enhanced coherency with peer-to-peer DMA and memory sharing.
The physical phenomena on which the device relies (such as spinning platters in a hard drive) will also impose limits; for instance, no spinning platter shipping in 2009 saturates SATA revision 2.0 (3 Gbit/s), so moving from this 3 Gbit/s interface to USB 3.0 at 4.8 Gbit/s for one spinning drive will result in no increase in realized transfer rate.
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providing backward compatibility. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide ...
HyperTransport comes in four versions—1.x, 2.0, 3.0, and 3.1—which run from 200 MHz to 3.2 GHz. It is also a DDR or "double data rate" connection, meaning it sends data on both the rising and falling edges of the clock signal. This allows for a maximum data rate of 6400 MT/s when running at 3.2 GHz.
MoCA 1.0 The first version of the standard, MoCA 1.0, was ratified in 2006 and supports transmission speeds of up to 135 Mb/s. [2] MoCA 1.1 MoCA 1.1 provides 175 Mbit/s net throughputs (275 Mbit/s PHY rate) and operates in the 500 to 1500 MHz frequency range. [11] MoCA 2.0 MoCA 2.0 offers actual throughputs (MAC rate) up to 1 Gbit/s.
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