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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).

  3. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15. The number is sometimes followed by a letter, indicating that components are grouped or matched with each other, e.g. R17A, R17B. The IEEE 315 standard contains a list of Class Designation Letters to use for electrical and electronic ...

  4. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

  5. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle size. [ 4 ] Some suppliers use proprietary particle size descriptions, Henkel/Loctite descriptions are given for comparison.

  6. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying

  7. C H E L S E A G R E E N P U B L I S H I N G W H I T E R I V E ...

    images.huffingtonpost.com/2007-09-10-EOA...

    %PDF-1.5 %âãÏÓ 100 0 obj > endobj xref 100 62 0000000016 00000 n 0000002402 00000 n 0000002539 00000 n 0000001570 00000 n 0000002637 00000 n 0000002762 00000 n 0000003272 00000 n 0000003519 00000 n 0000003561 00000 n 0000004173 00000 n 0000005340 00000 n 0000005569 00000 n 0000005954 00000 n 0000006116 00000 n 0000006328 00000 n 0000006538 00000 n 0000006700 00000 n 0000006911 00000 n ...

  8. Moisture sensitivity level - Wikipedia

    en.wikipedia.org/wiki/Moisture_sensitivity_level

    Moisture sensitivity levels are specified in technical standard IPC/JEDEC Moisture/reflow Sensitivity Classification for Nonhermetic Surface-Mount Devices. [1] The times indicate how long components can be outside of dry storage before they have to be baked to remove any absorbed moisture. MSL 6 – Mandatory bake before use; MSL 5A – 24 hours

  9. Microvia - Wikipedia

    en.wikipedia.org/wiki/Microvia

    These failures result from the thermomechanical stresses caused by coefficient of thermal expansion (CTE) mismatch, in the PCB thickness direction, between the metallization in a microvia structure and the dielectric materials surrounding the metal. The following paragraph highlights some of the microvia reliability research.

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