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Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre-scale or smaller. These devices are typically made from semiconductor materials. Many components of a ...
Miniaturization of various devices presents challenges in many areas of science and engineering: physics, chemistry, materials science, computer science, ultra-precision engineering, fabrication processes, and equipment design. It is also giving rise to various kinds of interdisciplinary research. [1]
A parallel line of research seeks to create nanoelectronic devices which could interact with single cells for use in basic biological research. [21] These devices are called nanosensors. Such miniaturization on nanoelectronics towards in vivo proteomic sensing should enable new approaches for health monitoring, surveillance, and defense technology.
The vapor from the source condenses onto a substrate, creating a thin film of high-purity material. Film thicknesses from a single atomic layer to many micrometers can be achieved. This technique is used in microelectronics, optics, and material research, and to produce solar cells and many other products.
Lightwaves are focused through a mask onto a surface. They solidify a chemical film. The soft, unexposed parts of the film are washed away. Then acid etches away the material not protected. Microtechnology's most famous success is the integrated circuit. It has also been used to construct micromachinery.
The insulating material has traditionally been a form of SiO 2 or a silicate glass, but recently new low dielectric constant materials, also called low-κ dielectrics, are being used (such as silicon oxycarbide), typically providing dielectric constants around 2.7 (compared to 3.82 for SiO 2), although materials with constants as low as 2.2 are ...
technology node – an industry standard semiconductor manufacturing process generation defined by the minimum size of the transistor gate length thermocompression bonding – a bonding technique where two metal surfaces are brought into contact with simultaneous application of force and heat
MEMS microcantilever resonating inside a scanning electron microscope Proposal submitted to DARPA in 1986 first introducing the term "microelectromechanical systems". MEMS (micro-electromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts.