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Hot-bar reflow is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element (called a thermode) to a temperature sufficient to melt the solder. Pressure is applied through the entire process (usually 15 seconds) to ensure that components stay in place during cooling.
Solder melts at approximately 185 °C (365 °F). Soldering irons are designed to reach a temperature range of 200 to 480 °C (392 to 896 °F). [1] Soldering irons are most often used for installation, repairs, and limited production work in electronics assembly. High-volume production lines use other soldering methods. [2]
Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron. [2] In 75 Pb 25: 156: 165 [12] Pb: No
Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K), [3] and is commonly used in electronics, plumbing, and sheet metal work.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
The reflow soldering of through-hole components using solder paste in a convection oven process is called intrusive soldering. The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state.
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