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Clearance between package body and PCB. H Height of package from pin tip to top of package. T Thickness of pin. L Length of package body only. L W Pin width. L L Pin length from package to pin tip. P Pin pitch (distance between conductors to the PCB). W B Width of the package body only. W L Length from pin tip to pin tip on the opposite side.
IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Engineering fits are generally used as part of geometric dimensioning and tolerancing when a part or assembly is designed. In engineering terms, the "fit" is the clearance between two mating parts, and the size of this clearance determines whether the parts can, at one end of the spectrum, move or rotate independently from each other or, at the other end, are temporarily or permanently joined.
In mechanical engineering, backlash, sometimes called lash, play, or slop, is a clearance or lost motion in a mechanism caused by gaps between the parts. It can be defined as "the maximum distance or angle through which any part of a mechanical system may be moved in one direction without applying appreciable force or motion to the next part in mechanical sequence."
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SMEMA is an acronym for the Surface Mount Equipment Manufacturers Association.. In 1999 they merged with the IPC to form the IPC SMEMA Council. [1]One standard they have is for the wiring of communications between Surface mount technology producing machinery such as a Stencil Printer or a Pick and Place Machine on an Electronics production line.
An American Airlines statement said the “crew of American Airlines flight 298 requested and received right-turn clearance and complied with controller instructions.” ...
A SID clearance is issued to the pilot based on a combination of the destination, the first waypoint in the flight plan, and the takeoff runway used. A standard instrument departure procedure consists of a number of waypoints or fixes, which may either be given by their geographical coordinates or be defined by radio beacons , such as VOR or ...