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Fugacity and BCF relate to each other in the following equation: = [6] where Z Fish is equal to the Fugacity capacity of a chemical in the fish, P Fish is equal to the density of the fish (mass/length 3), BCF is the partition coefficient between the fish and the water (length 3 /mass) and H is equal to the Henry's law constant (Length 2 /Time 2) [6]
A sieve analysis (or gradation test) is a practice or procedure used in geology, civil engineering, [1] and chemical engineering [2] to assess the particle size distribution (also called gradation) of a granular material by allowing the material to pass through a series of sieves of progressively smaller mesh size and weighing the amount of material that is stopped by each sieve as a fraction ...
Exponential decay is a scalar multiple of the exponential distribution (i.e. the individual lifetime of each object is exponentially distributed), which has a well-known expected value. We can compute it here using integration by parts .
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The Variant Call Format or VCF is a standard text file format used in bioinformatics for storing gene sequence variations. The format was developed in 2010 for the 1000 Genomes Project and has since been used by other large-scale genotyping and DNA sequencing projects. [ 1][ 2] VCF is a common output format for variant calling programs due to ...
With some exceptions regarding erroneous values, infinities, and denormalized numbers, Excel calculates in double-precision floating-point format from the IEEE 754 specification [ 1] (besides numbers, Excel uses a few other data types [ 2] ). Although Excel allows display of up to 30 decimal places, its precision for any specific number is no ...
Particle decay. In particle physics, particle decay is the spontaneous process of one unstable subatomic particle transforming into multiple other particles. The particles created in this process (the final state) must each be less massive than the original, although the total mass of the system must be conserved.
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.