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  2. List of 7400-series integrated circuits - Wikipedia

    en.wikipedia.org/wiki/List_of_7400-series...

    Parts in this section have a pin count of 14 pins or more. The lower part numbers were established in the 1960s and 1970s, then higher part numbers were added incrementally over decades. IC manufacturers continue to make a core subset of this group, but many of these part numbers are considered obsolete and no longer manufactured.

  3. 7400-series integrated circuits - Wikipedia

    en.wikipedia.org/wiki/7400-series_integrated...

    The first part number in the series, the 7400, is a 14-pin IC containing four two-input NAND gates. Each gate uses two input pins and one output pin, with the remaining two pins being power (+5 V) and ground. This part was made in various through-hole and surface-mount packages, including flat pack and plastic/ceramic dual in-line.

  4. Integrated circuit layout - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_layout

    Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.

  5. Integrated circuit design - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_design

    Engineer using an early IC-designing workstation to analyze a section of a circuit design cut on rubylith, circa 1979. Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs

  6. Interconnect (integrated circuits) - Wikipedia

    en.wikipedia.org/wiki/Interconnect_(integrated...

    IC with complex circuits require multiple levels of interconnect to form circuits that have minimal area. As of 2018, the most complex ICs may have over 15 layers of interconnect. Each level of interconnect is separated from each other by a layer of dielectric. To make vertical connections between interconnects on different levels, vias are used.

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  8. Dual in-line package - Wikipedia

    en.wikipedia.org/wiki/Dual_in-line_package

    Side view of a dual in-line package (DIP) IC Dual in-line (DIP) integrated circuit metal tape base with contacts. The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices.

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