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LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5 ) and it has 1700 protruding pins to make contact with the pads on the processor.
The 100 Series chipsets (codenamed Sunrise Point), for Skylake processors using the LGA 1151 socket, [89] were released in the third quarter of 2015. [90] The 200 Series chipsets (codenamed Union Point) were introduced along with Kaby Lake processors, which also use the LGA 1151 socket; [91] these were released in the first quarter of 2017. [92]
LGA 1700 socket for desktop processors. [25] BGA1744 Type3 and Type4 HDI for mobile processors [2] 20 PCIe lanes from CPU 16 PCIe 5.0 lanes [18] 4 PCIe 4.0 lanes [18] Chipset link - DMI 4.0 ×8 link with Intel 600 series PCH chipsets; DDR5, DDR4, LPDDR5, and LPDDR4X memory support Up to DDR5-4800; Up to DDR4-3200; Up to LPDDR5-5200; Up to ...
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
LGA 1151 LGA 1200 LGA 1700: Intel 7, 14 nm, 22 nm, 32 nm, 45 nm 17 W – 125 W 2 - 6 /w hyperthreading, 2.5 – 8 GT/s ... List of Intel processors.
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.
LGA 1700: DMI 4.0 ×8: January 2022 SRL67 (H0) CM8071504651805 BX80715G6900 $42 Standard power, embedded: Celeron G6900E: 2 (2) 3.0 GHz — 2 × 1.25 MB 4 MB UHD 710 300–1300 MHz 46 W — LGA 1700 DMI 4.0 ×8 January 2022 SRL6Q (H0) CM8071504653807 $44 Low power: Celeron G6900T: 2 (2) 2.8 GHz — 2 × 1.25 MB 4 MB UHD 710 300–1300 MHz 35 W ...