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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...

3. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area to flux ratio of the solder particle, resulting in flux exhaustion. While solder paste can be manufactured using any size range, there has been a move towards finer particle sizes, especially for fine feature stencil ...

4. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

5. Tinning - Wikipedia

   en.wikipedia.org/wiki/Tinning

   The tinning set consists of at least one pot of molten tin, with a zinc chloride flux on top, and a grease pot. The flux dries the plate and prepares it for the tin to adhere. If a second tin pot is used, called the wash pot, it contains tin at a lower temperature. This is followed by the grease pot, which contains oil and a tinning machine ...

6. Wave soldering - Wikipedia

   en.wikipedia.org/wiki/Wave_soldering

   Flux in the wave soldering process has a primary and a secondary objective. The primary objective is to clean the components that are to be soldered, principally any oxide layers that may have formed. [3] There are two types of flux, corrosive and noncorrosive. Noncorrosive flux requires precleaning and is used when low acidity is required.

7. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process