Search results
Results from the WOW.Com Content Network
Parts Average Testing is a statistical method for recognizing and quarantining semiconductor die that have a higher probability of reliability failures. This technique identifies characteristics that are within specification but outside of a normal distribution for that population as at-risk outliers not suitable for high reliability applications.
The goal of HALT is to proactively find weaknesses and fix them, thereby increasing product reliability. Because of its accelerated nature, HALT is typically faster and less expensive than traditional testing techniques. HALT is a test technique called test-to-fail, where a product is tested until failure. HALT does not help to determine or ...
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
The highly accelerated stress test (HAST) method was first proposed by Jeffrey E. Gunn, Sushil K. Malik, and Purabi M. Mazumdar of IBM. [ 1 ] The acceleration factor for elevated humidity is empirically derived to be
XRay, Optical, and THz image of a packaged IC. [2]Terahertz imaging is an emerging and significant nondestructive evaluation (NDE) technique used for dielectric (nonconducting, i.e., an insulator) materials analysis and quality control in the pharmaceutical, biomedical, security, materials characterization, and aerospace industries.
graph with an example of steps in a failure mode and effects analysis. Failure mode and effects analysis (FMEA; often written with "failure modes" in plural) is the process of reviewing as many components, assemblies, and subsystems as possible to identify potential failure modes in a system and their causes and effects.
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
Semiconductor characterization techniques are used to characterize a semiconductor material or device (p–n junction, Schottky diode, solar cell, etc.).Some examples of semiconductor properties that could be characterized include the depletion width, carrier concentration, carrier generation and recombination rates, carrier lifetimes, defect concentration, and trap states.