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A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit ...
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a small oven with a door.
The logic package is on the bottom because it needs many more BGA connections to the motherboard. Typical logic plus memory PoP stack, common to mobile phone SoCs or baseband modems from 2005 onward. During PCB assembly, the bottom package of a PoP stack is placed directly on the PCB, and the other package(s) of the stack are stacked on top.
A typical spring-loaded solder sucker A solder sucker partially dismantled showing the spring. A desoldering pump, colloquially known as a solder sucker, is a manually-operated device which is used to remove solder from a printed circuit board. There are two types: the plunger style and bulb style. [1]
This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include pin grid array (PGA) or land grid array ...