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  2. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

  3. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...

  4. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.

  5. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]

  6. Brazing - Wikipedia

    en.wikipedia.org/wiki/Brazing

    The flux also serves the purpose of cleaning any contamination left on the brazing surfaces. Flux can be applied in any number of forms including flux paste, liquid, powder or pre-made brazing pastes that combine flux with filler metal powder. Flux can also be applied using brazing rods with a coating of flux, or a flux core.

  7. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process

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