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  2. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

  3. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15. The number is sometimes followed by a letter, indicating that components are grouped or matched with each other, e.g. R17A, R17B. The IEEE 315 standard contains a list of Class Designation Letters to use for electrical and electronic ...

  4. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying

  5. List of computing and IT abbreviations - Wikipedia

    en.wikipedia.org/wiki/List_of_computing_and_IT...

    EDA—Electronic Design Automation; EDGE—Enhanced Data rates for GSM Evolution; EDI—Electronic Data Interchange; EDO—Extended Data Out; EDSAC—Electronic Delay Storage Automatic Calculator; EDVAC—Electronic Discrete Variable Automatic Computer; EEPROM—Electronically Erasable Programmable Read-Only Memory; EFF—Electronic Frontier ...

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Clearance between package body and PCB. H Height of package from pin tip to top of package. T Thickness of pin. L Length of package body only. L W Pin width. L L Pin length from package to pin tip. P Pin pitch (distance between conductors to the PCB). W B Width of the package body only. W L Length from pin tip to pin tip on the opposite side.

  7. IPC - Wikipedia

    en.wikipedia.org/wiki/IPC

    IPC (electronics), an international trade association for the printed-board and electronics assembly industries; IPC Systems, a firm providing communication systems for financial markets; Idaho Power Company, an American utility; International Paralympic Committee, an international non-profit organisation of elite sports for athletes with ...

  8. Microvia - Wikipedia

    en.wikipedia.org/wiki/Microvia

    At the electronic component level, this translates to components with increased I/Os with smaller footprint areas (e.g. flip-chip packages, chip-scale packages, and direct chip attachments), and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs) (e.g. finer lines and spaces, and smaller vias).

  9. Device under test - Wikipedia

    en.wikipedia.org/wiki/Device_under_test

    A device under test (DUT), also known as equipment under test (EUT) and unit under test (UUT), is a manufactured product undergoing testing, either at first manufacture or later during its life cycle as part of ongoing functional testing and calibration checks.

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