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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
IEEE 200-1975 or "Standard Reference Designations for Electrical and Electronics Parts and Equipments" is a standard that was used to define referencing naming systems for collections of electronic equipment. IEEE 200 was ratified in 1975. The IEEE renewed the standard in the 1990s, but withdrew it from active support shortly thereafter.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
PBS—Portable Batch System; PC—Personal Computer; PCB—Printed Circuit Board; PCB—Process Control Block; PC DOS—Personal Computer Disc Operating System; PCI—Peripheral Component Interconnect; PCIe—PCI Express; PCI-X—PCI Extended; PCL—Printer Command Language; PCMCIA—Personal Computer Memory Card International Association; PCM ...
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
IPC (electronics), an international trade association for the printed-board and electronics assembly industries; IPC Systems, a firm providing communication systems for financial markets; Idaho Power Company, an American utility; International Paralympic Committee, an international non-profit organisation of elite sports for athletes with ...
At the electronic component level, this translates to components with increased I/Os with smaller footprint areas (e.g. flip-chip packages, chip-scale packages, and direct chip attachments), and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs) (e.g. finer lines and spaces, and smaller vias).
Today portable electronic systems include roughly 2–40 discrete passive devices/integrated circuit or module. [18] This shows that monolithic or module integration is not capable to include all functionality based on passive components in system realisations, and variety of technologies is needed to minimize logistics and system size.
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