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Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board. A row of through-holes acting as the footprint for a pin header.. A footprint or land pattern is the arrangement of pads (in surface-mount technology) [1] or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...
MLPD are designed to provide a footprint-compatible replacement for small-outline integrated circuit (SOIC) packages. Micro lead frame (MLF) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the printed circuit board. The ...
Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection (HDI) substrate.
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
In electronic design, a netlist is a description of the connectivity of an electronic circuit. [1] [2] In its simplest form, a netlist consists of a list of the electronic components in a circuit and a list of the nodes they are connected to.
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