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2. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   Many sites recommend using a potting product to protect sensitive electronic components from impact, vibration, and loose wires. [2] In the potting process, an electronic assembly is placed inside a mold (the "pot" [3]) which is then filled with an insulating liquid compound that hardens, permanently protecting the assembly. The mold may be ...

3. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...

4. Electrically conductive adhesive - Wikipedia

   en.wikipedia.org/wiki/Electrically_conductive...

   An electrically conductive adhesive is a glue that is primarily used for electronics. The electric conductivity is caused by a component that makes ca. 80% of the total mass of an electrically conductive adhesive. This conductive component is suspended in a sticky component that holds the electrically conductive adhesive together.

5. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Soldering differs from gluing significantly in that the filler metals directly bond with the surfaces of the workpieces at the junction to form a bond that is both electrically conductive and gas- and liquid-tight. [8] Soft soldering is characterized by having a melting point of the filler metal below approximately 400 °C (752 °F), [9 ...

6. Adhesive bonding of semiconductor wafers - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding_of...

   The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives, especially SU-8 and benzocyclobutene (BCB), are specialized for production of MEMS and electronic components. [2] The procedure enables bonding temperatures from 1000 °C down to room temperature. [1]

7. Thermal paste - Wikipedia

   en.wikipedia.org/wiki/Thermal_paste

   Thermal paste consists of a polymerizable liquid matrix and large volume fractions of electrically insulating, but thermally conductive filler. Typical matrix materials are epoxies, silicones (silicone grease), urethanes, and acrylates; solvent-based systems, hot-melt adhesives, and pressure-sensitive adhesive tapes are also available.