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  2. Chemistry of pressure-sensitive adhesives - Wikipedia

    en.wikipedia.org/wiki/Chemistry_of_pressure...

    Pressure sensitive adhesives are viscoelastic polymers with their rheology tuned to the desired bonding and de-bonding characteristics needed. [5] Typical materials used to make the adhesive include: acrylate polymer, [6] rubber, either natural rubber or synthetic thermoplastic elastomer [7] silicone rubber; and others

  3. Adhesives bonding in structural steel applications - Wikipedia

    en.wikipedia.org/wiki/Use_of_adhesives_in...

    Adhesive bonding is a process by which two members of equal or dissimilar composition are joined. It is used in place of, or to complement other joining methods such mechanical fasting by the use nails, rivets, screws or bolts and many welding processes. [1]

  4. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .

  5. State considers bonding reforms as it makes progress ... - AOL

    www.aol.com/state-considers-bonding-reforms...

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  6. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Detlef Symietz, Andreas Lutz: Structural bonding in vehicle construction. Properties, applications and performance of a new joining process. (= The Library of Technology, Volume 291). Verlag Moderne Industrie, 2006, ISBN 3-937-88955-8. DIN 2304-1 Adhesive Technology - Quality Requirements for Adhesive Processes. Part 1: Process Chain.

  7. Surface activated bonding - Wikipedia

    en.wikipedia.org/wiki/Surface_activated_bonding

    Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High-strength bonding of semiconductors, metals, and dielectrics can be obtained even at room temperature ...

  8. Body of missing Indian journalist found in septic tank - AOL

    www.aol.com/body-missing-indian-journalist-found...

    The body of an Indian journalist who had reported on alleged corruption in the country has been found in a septic tank in Chhattisgarh state. Mukesh Chandrakar, 32, went missing on New Year's Day ...

  9. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    There are three major requirements of creating a desirable surface for adhesive bonding of plastics: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than the surface energy of the adhesive for good wetting; and the surface profile can be improved to provide mechanical ...