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  2. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...

  3. Circuit diagram - Wikipedia

    en.wikipedia.org/wiki/Circuit_diagram

    A circuit diagram (or: wiring diagram, electrical diagram, elementary diagram, electronic schematic) is a graphical representation of an electrical circuit. A pictorial circuit diagram uses simple images of components, while a schematic diagram shows the components and interconnections of the circuit using standardized symbolic representations.

  4. Interconnect (integrated circuits) - Wikipedia

    en.wikipedia.org/wiki/Interconnect_(integrated...

    The material interconnects are made from depends on many factors. Chemical and mechanical compatibility with the semiconductor substrate and the dielectric between the levels of interconnect is necessary, otherwise barrier layers are needed. Suitability for fabrication is also required; some chemistries and processes prevent the integration of ...

  5. Integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit

    A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.

  6. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.

  7. Tape-automated bonding - Wikipedia

    en.wikipedia.org/wiki/Tape-automated_bonding

    Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.

  8. Integrated circuit design - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_design

    A challenge most critical to analog IC design involves the variability of the individual devices built on the semiconductor chip. Unlike board-level circuit design which permits the designer to select devices that have each been tested and binned according to value, the device values on an IC can vary widely which are uncontrollable by the ...

  9. Wiring diagram - Wikipedia

    en.wikipedia.org/wiki/Wiring_diagram

    A wiring diagram for parts of an electric guitar, showing semi-pictorial representation of devices arranged in roughly the same locations they would have in the guitar. An automotive wiring diagram, showing useful information such as crimp connection locations and wire colors. These details may not be so easily found on a more schematic drawing.