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Good solder joints between BGA and PCB. Ball grid arrays (BGA) and chip scale packages (CSA) present special difficulties for testing and rework, as they have many small, closely spaced pads on their underside which are connected to matching pads on the PCB. Connecting pins are not accessible from the top for testing, and cannot be desoldered ...
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In addition to operating its own research facilities, as of 2022, Battelle managed or co-managed on behalf of the United States Department of Energy the following national laboratories: Brookhaven National Laboratory (through Brookhaven Science Associates, LLC – a collaboration between Battelle and Stony Brook University)
The process can be used to provide important benchmarking information about newly acquired products, prototype PCBs or any circuit board the company does not own. For example, reverse engineering a circuit assembly reveals whether or not the fabricator has exactly matched the design specifications of the board.
2011.2, The company introduced Featherlite® SMC, with a 1.43 sp.gr (relative density), lighter than standard-density SMC (1.9 sp.gr). 2012, The company introduced N-sulGuard® SMC to support Ag and Construction Equipment and Electrical markets. [4] 2013.8, the company announced Airilite™, an ultra-low density SMC, about 1.18 sp.gr. [9]
An Automated Optical Inspection device. Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).
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