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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
A via fence consists of a row of via holes, that is, holes that pass through the substrate and are metallised on the inside to connect to pads on the top and bottom of the substrate. In a stripline format both the top and bottom of the dielectric sheet are covered with a metal ground plane so any via holes are automatically grounded at both ends.
Clearance between package body and PCB. H Height of package from pin tip to top of package. T Thickness of pin. L Length of package body only. L W Pin width. L L Pin length from package to pin tip. P Pin pitch (distance between conductors to the PCB). W B Width of the package body only. W L Length from pin tip to pin tip on the opposite side.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner. Each terminal on a BTB connector is connected to a PCB. A BTB connector includes housing and a specific number of terminals.
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs). It builds on a preceding step, called placement, which determines the location of each active element of an IC or component on a PCB.
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