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  2. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...

  3. Eurocard (printed circuit board) - Wikipedia

    en.wikipedia.org/wiki/Eurocard_(printed_circuit...

    Eurocard is an IEEE standard format for printed circuit board (PCB) cards that can be plugged together into a standard chassis which, in turn, can be mounted in a 19-inch rack. The chassis consists of a series of slotted card guides on the top and bottom, into which the cards are slid so they stand on end, like books on a shelf.

  4. Copper foil - Wikipedia

    en.wikipedia.org/wiki/Copper_foil

    Copper foil is a thin sheet of copper metal that is widely used in various applications due to its excellent electrical conductivity, malleability, and corrosion resistance. It is an essential material in the electronics industry, especially for manufacturing printed circuit boards (PCBs) and other electronic components.

  5. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.

  6. Printed circuit board milling - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board_milling

    A milled printed circuit board. Printed circuit board milling (also: isolation milling) is the milling process used for removing areas of copper from a sheet of printed circuit board (PCB) material to recreate the pads, signal traces and structures according to patterns from a digital circuit board plan known as a layout file. [1]

  7. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Thin small-outline package (TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm. Shrink small-outline package (SSOP): pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm. Thin shrink small-outline package (TSSOP). Quarter-size small-outline package (QSOP): with pin spacing of 0.635 mm.

  8. Copper pour - Wikipedia

    en.wikipedia.org/wiki/Copper_pour

    Copper pour on a printed circuit board flowing around tracks and pads. Copper pour is sometimes filled using a hatch fill style. In electronics, the term copper pour refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards). Copper pour is commonly used to create a ground plane.

  9. Thermal relief - Wikipedia

    en.wikipedia.org/wiki/Thermal_relief

    Thermal pads can be seen in several locations on this printed circuit board (PCB), in particular, the bottom pad of the three vertical pads in the top left corner. A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with ...

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