Search results
Results from the WOW.Com Content Network
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
Once tested, a wafer is typically reduced in thickness in a process also known as "backlap", [118]: 6 "backfinish", "wafer backgrind" or "wafer thinning" [191] before the wafer is scored and then broken into individual dies, a process known as wafer dicing. Only the good, unmarked chips are packaged.
M1 wafer size (156.75 mm) is in the process of being phased out in China as of 2020. Various nonstandard wafer sizes have arisen, so efforts to fully adopt the M10 standard (182 mm) are ongoing. Like other semiconductor fabrication processes, driving down costs has been the main driving factor for this attempted size increase, in spite of the ...
Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]
Modern cleanrooms use automated, robotic wafer track systems to coordinate the process. [12] The procedure described here omits some advanced treatments, such as thinning agents. [13] The photolithography process is carried out by the wafer track and stepper/scanner, and the wafer track system and the stepper/scanner are installed side by side.
Schematic process flow of dry etch and photosensitive BCB wafer bonding technique. [15] Benzocyclobutene (BCB) is a hydrocarbon that is widely used in electronics manufacturing. [16] BCB exists in a dry etch and a photosensitive version, each requiring different procedural steps for structuring (compare BCB process flow). [17]
Substrate mapping (or wafer mapping) is a process in which the performance of semiconductor devices on a substrate is represented by a map showing the performance as a colour-coded grid. The map is a convenient representation of the variation in performance across the substrate, since the distribution of those variations may be a clue as to ...
In semiconductor manufacturing, a process corner is an example of a design-of-experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners represent the extremes of these parameter variations within which a circuit that has been etched ...