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GES International Limited is an engineering and manufacturing company founded as a sole proprietorship called Goh Electronics Services by Goh Lik Tuan in 1975. It is based in Singapore and has an office in China. It is on the SGX, the Singapore stock exchange, and it is a listed component of the Straits Times Index. In 2006, it became a ...
Forbes ranked him as the 25th richest person in Singapore in 2006, with a fortune of $175 million. The company is engaged in the supply chain management in the consumer electronics sector, electronic manufacturing services (EMS), creation of technology products, as well as property and equity investments.
Audio equipment manufacturers of Singapore (1 C, 1 P) S. Semiconductor companies of Singapore (5 P) Pages in category "Electronics companies of Singapore"
Location of Singapore Singapore is a sovereign island country in maritime Southeast Asia. A global city, it has a highly developed market economy, based historically on extended entrepôt trade and more recently as a financial hub as well. Its economy is known as the most freest, most innovative, most competitive, most dynamic and most business-friendly in the world by various multinational ...
This list is based on the Forbes Global 2000, which ranks the world's 2,000 largest publicly traded companies.The Forbes list takes into account a multitude of factors, including the revenue, net profit, total assets and market value of each company; each factor is given a weighted rank in terms of importance when considering the overall ranking.
Sunvalley Group (Chinese: 泽宝集团 [7]), previously known as Sunvalleytek International Inc., [8] [9] [10] is a Chinese consumer electronics company founded in 2007 and headquartered in Shenzhen. [11] [12] [13] In addition to its headquarters in Shenzhen, the company has offices in San Francisco, Tokyo, Singapore, and Hamburg. It owns six ...
Jack Nicholson Makes Rare TV Appearance at ‘SNL50,’ Introduces Adam Sandler’s Heartfelt Song Honoring the Show’s History
ASE provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world. [10] The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D and 3D packaging, system in package (SiP) and copper wire bonding. [9] [11]