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A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components. A rework station is a place to do this work—the tools and supplies for this work, typically on a workbench. Other kinds of rework require other tools. [1]
The underside of a FC-PGA package (The die is on the other side.) A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed.
Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins that can be put on a dual in-line or flat package. The whole bottom surface ...
Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it. eWLB: Embedded wafer level ball grid array: Variation of WLCSP. MICRO SMD-Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied without a package.
Primary, alternate, contingency and emergency (PACE) is a methodology used to build a communication plan. [1] The method requires the author to determine the different stakeholders or parties that need to communicate and then determine, if possible, the best four, different, redundant forms of communication between each of those parties.
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
Inside a wire-bonded BGA package. This package has an Nvidia GeForce 256 GPU. Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication .
Pace is planning to add two more Pulse lines, both of which will be located in the South Side of Chicago and the south suburbs. One line will mostly run along 95th Street from the Moraine Valley Community College to the Red Line 's 95th/Dan Ryan station ; [ 21 ] another will mostly run along Halsted Street from Harvey station on the Metra ...