Ad
related to: laser cutting process pdf- What can you Create?
What can you make with a laser?
Find out with our popular resources
- Laser Product Line
Which laser is right for you? Find
the right one in our product line.
- Laser Applications
Discover more industries using
lasers for engraving.
- Request Free Sample Kit
See our results with your own eyes.
Laser cut a variety of materials.
- What can you Create?
Search results
Results from the WOW.Com Content Network
Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
Download as PDF; Printable version; ... laser cutting, ... The underlying physical process creating photons in a laser is the same as in thermal radiation, but the ...
Drilling and cutting with lasers is advantageous in that there is little to no wear on the cutting tool as there is no contact to cause damage. Milling with a laser is a three dimensional process that requires two lasers, but drastically cuts costs of machining parts. [2] [7] Lasers can be used to change the surface properties of a workpiece.
Laser types with distinct laser lines are shown above the wavelength bar, while below are shown lasers that can emit in a wavelength range. The height of the lines and bars gives an indication of the maximal power/pulse energy commercially available, while the color codifies the type of laser material (see the figure description for details).
Laser ablation or photoablation (also called laser blasting [1] [2] [3]) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates .
Laser drilling is the process of creating thru-holes, referred to as “popped” holes or “percussion drilled” holes, by repeatedly pulsing focused laser energy on a material. The diameter of these holes can be as small as 0.002” (~50 μm).
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Laser marked electronic part. Laser engraving is the practice of using lasers to engrave an object. The engraving process renders a design by physically cutting into the object to remove material.
Ad
related to: laser cutting process pdf