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When a CPU heat spreader is coupled to the die via thermal paste, performance enthusiasts such as overclockers are able to, in a process known as "delidding", [3] pry the heat spreader, or CPU "lid", from the die. This allows them to replace the thermal paste, which is usually of low-quality, with a thermal paste having greater thermal ...
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
There is much debate about the merits of compounds, and overclockers often consider some compounds to be superior to others. The main consideration is to use the minimal amount of thermal compound required to even out surfaces, as the thermal conductivity of compound is typically 1/3 to 1/400 that of metal, though much better than air.
Properly applied thermal interface materials displace the air that is present in the gaps between the two objects with a material that has a much-higher thermal conductivity. Air has a thermal conductivity of 0.022 W/(m·K) [ 19 ] while TIMs have conductivities of 0.3 W/(m·K) [ 20 ] and higher.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
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