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  2. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

  3. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...

  4. Pad cratering - Wikipedia

    en.wikipedia.org/wiki/Pad_cratering

    It is a useful test for all pad geometries and is sensitive to board design and materials. The ball pull test is specifically design for BGA components and has a large sensitivity to the solder alloy and joint formation. The ball shear test is also specified for BGA components and involves shearing the solder balls of the BGA.

  5. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle size. [ 4 ] Some suppliers use proprietary particle size descriptions, Henkel/Loctite descriptions are given for comparison.

  6. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    In informal usage, the term "printed circuit board" most commonly means "printed circuit assembly" (with components). The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly".

  7. Dye-and-pry - Wikipedia

    en.wikipedia.org/wiki/Dye-and-Pry

    Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...

  8. 6 ways for seniors and retirees to save on homeowners insurance

    www.aol.com/finance/ways-seniors-save-homeowners...

    The average cost of a homeowners policy has risen more than 30% since 2020. Yet you can still find ways to save on insurance, especially for seniors. See cost-saving tips for paying less on your ...

  9. Wiring Harness Manufacturer's Association - Wikipedia

    en.wikipedia.org/wiki/Wiring_Harness_Manufacturer...

    The Wiring Harness Manufacturer's Association is a trade group for American manufacturers of wiring harnesses, electronic cable assemblies, and cord sets, along with their suppliers and distributors. [1]

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