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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
The IPC-NC-349 format is the only IPC standard governing drill and routing formats. [5] XNC is a strict subset of IPC-NC-349, Excellon a big superset. Many indefinite NC files pick some elements of the IPC standard. [1] A digital rights managed copy of the specification is available from the IPC website, for a fee.
Hermes is a machine-to-machine communication standard used in the SMT assembly industry. [1]IPC-HERMES-9852. It is a successor to the SMEMA standard, introducing improvements such as: simpler physical wiring (Ethernet), use of popular data transmission formats (TCP/IP and XML), reduced number of barcode scanners (required only once at the beginning of the line), transmission of board data ...
IEEE 200-1975 or "Standard Reference Designations for Electrical and Electronics Parts and Equipments" is a standard that was used to define referencing naming systems for collections of electronic equipment. IEEE 200 was ratified in 1975. The IEEE renewed the standard in the 1990s, but withdrew it from active support shortly thereafter.
The IPC preferred term for an assembled board is circuit card assembly (CCA), [20] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying
These failures result from the thermomechanical stresses caused by coefficient of thermal expansion (CTE) mismatch, in the PCB thickness direction, between the metallization in a microvia structure and the dielectric materials surrounding the metal. The following paragraph highlights some of the microvia reliability research.
Users upload either a complete design package, like ODB++ or IPC-2581, [4] or individual data packets, such as Gerber, Bill of Materials, and Pick and Place [5] files.. Sherlock incorporates stresses from a variety of environments into its physics-based prediction algorithms, including elevated temperature, thermal cycling, vibrations (random and harmonic), mechanical shock and electrical ...
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...