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Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...
Limits on physical memory for 32-bit platforms also depend on the presence and use of Physical Address Extension (PAE), which allows 32-bit systems to use more than 4 GB of physical memory. PAE and 64-bit systems may be able to address up to the full address space of the x86 processor.
It is designed to improve memory performance and capacity by allowing multiple memory modules to be each connected to the memory controller using a serial interface, rather than a parallel one. Unlike the parallel bus architecture of traditional DRAMs, an FB-DIMM has a serial interface between the memory controller and the advanced memory ...
[4] [5] Some disadvantages include generally being more expensive than desktop computers, a lack of customizability—most of the internal hardware such as the RAM and the SSD, especially in post-late-2010s machines, is soldered onto the system board—a lack of upgrade paths for the CPU, RAM, and technology of the display, and the difficulty ...
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
There are two versions of the Centris 650: One with 4 MB of RAM soldered to the logic board and an FPU-less Motorola 68LC040 CPU, and one with 8 MB of logic board RAM, a full Motorola 68040, and an onboard AAUI port for Ethernet. Each can be configured with an 80 MB, 230 MB, or 500 MB 3.5-inch hard drive.
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An outline drawing of a Type I TSOP with 32 leads. Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.