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2. Wire bonding - Wikipedia

   en.wikipedia.org/wiki/Wire_bonding

   Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...

3. Cross section (electronics) - Wikipedia

   en.wikipedia.org/wiki/Cross_section_(electronics)

   Viewing the internal structures of electronic components by cross section can reveal problems with manufacturing and material quality. In integrated circuits, a cross section can reveal the die, its active layers, the die paddle, and 1st level interconnect (wire bonds or solder bumps).

4. Point-to-point construction - Wikipedia

   en.wikipedia.org/wiki/Point-to-point_construction

   Solder makes a strong electrical and mechanical connection. Point-to-point wiring is not suitable for automated assembly (though see wire wrap , a similar method that is) and is carried out manually, making it both more expensive and more susceptible to wiring errors than PCBs, as connections are determined by the person doing assembly rather ...

5. Head-in-pillow defect - Wikipedia

   en.wikipedia.org/wiki/Head-in-pillow_defect

   For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit ...

6. Solderability - Wikipedia

   en.wikipedia.org/wiki/Solderability

   Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

7. Whisker (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Whisker_(metallurgy)

   Microscopic view of tin used to solder electronic components, showing a whisker. Metal whiskering is a crystalline metallurgical phenomenon involving the spontaneous growth of tiny, filiform hairs from a metallic surface. The effect is primarily seen on elemental metals but also occurs with alloys.

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   mail.aol.com

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9. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Desoldering a contact from a wire. Soldering (US: / ˈ s ɒ d ər ɪ ŋ /; UK: / ˈ s oʊ l d ər ɪ ŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong ...