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2. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]

3. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

4. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Sn 96.5 Ag 3.5: 221 [11] Yes: Yes: Sn 96, Sn 96.5, 96S. Fine lamellar structure of densely distributed Ag 3 Sn. Annealing at 125 °C coarsens the structure and softens the solder. [51] Creeps via dislocation climb as a result of lattice diffusion. [72] Used as wire for hand soldering rework; compatible with SnCu 0.7, SnAg 3 Cu 0.5, SnAg 3.9 Cu ...

5. List of brazing alloys - Wikipedia

   en.wikipedia.org/wiki/List_of_brazing_alloys

   Wetting in hydrogen atmosphere is superior to wetting with flux. Mostly used on copper and nickel alloys. ... Dental solder. Yellow color. 5.7: 89: 5: Ir 0.3: Au 49.7 ...

6. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   The electric soldering iron is widely used for hand-soldering, consisting of a heating element in contact with the "iron" (a larger mass of metal, usually copper) which is in contact with the working tip made of copper. Usually, soldering irons can be fitted with a variety of tips, ranging from blunt, to very fine, to chisel heads for hot ...

7. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...