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An archived web page with links to package drawing collections of SMD, hermetic, plastic, RF, coaxial and hybrid power module varieties.corresponding to dimensions and names listed in the previous spreadsheet pages.
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system.
A modern example of multi-chip integrated circuit packages would be certain models of microprocessor, which may include separate dies for such things as cache memory within the same package. In a technique called flip chip, digital integrated circuit dies are inverted and soldered to a module carrier, for assembly into large systems. [8]
A single in-line package (SIP or SIL package) [8] has one row of connecting pins. It is not as popular as the DIP, but has been used for packaging RAM chips and multiple resistors with a common pin. As compared to DIPs with a typical maximum pin count of 64, SIPs have a typical maximum pin count of 24 with lower package costs.
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.