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LGA 2011, also called Socket R, is a CPU socket by Intel released on November 14, 2011. It launched along with LGA 1356 to replace its predecessor, LGA 1366 (Socket B) and LGA 1567 . [ 1 ] [ 2 ] While LGA 1356 was designed for dual-processor or low-end servers, LGA 2011 was designed for high-end desktops and high-performance servers.
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo ...
Socket 370, also known as PGA370, is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins. Socket 370 was replaced by Socket 423 in 2000.
The revealed socket Contacts of the Intel Core 9 Ultra 285K (left; LGA 1851), and i9-14900K (right, Socket 1700) LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake-PS and Arrow Lake-S desktop processors, released in October 24, 2024. [1] The number of contacts has increased, from 1700 (for LGA 1700 ...
The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for Quick Path Interconnect (QPI), and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to ...
Active cooling on CPUs started to appear on the Intel 80486, and by 1997 was standard on all desktop processors. [2] Chassis or case fans, usually one exhaust fan to expel heated air from the rear and optionally an intake fan to draw cooler air in through the front, became common with the arrival of the Pentium 4 in late 2000. [2]
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