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The USB 3.2 specification [7] added a second lane to the Enhanced SuperSpeed System besides other enhancements so that the SuperSpeedPlus USB system part implements the Gen 1×2, Gen 2×1, and Gen 2×2 operation modes. However, the SuperSpeed USB part of the system still implements the one-lane Gen 1×1 operation mode.
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [43] to 21.5 V with USB PD 2.0 [44] and 50.9 V with USB PD 3.1, [44] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
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The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
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