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Die size: 263 mm ²; Steppings: D0 [8] [9 ... Xeon X5550: SLBF5 (D0) 2.67 GHz 2/2/3/3 4 4 × 256 KB 8 MB 2 × 6.4 GT/s QPI 20× 3 × DDR3-1333 0.75–1.35 V 95 W
List of Intel Xeon processors.
Intel Xeon 3060 die shot. Based on Core microarchitecture; All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x; All models support uni-processor configurations; Die size: 143 mm 2; Steppings: B2, G0
The first Xeon-based machine to be in the first place of the TOP500 was the Chinese Tianhe-IA in November 2010, which used a mixed Xeon-Nvidia GPU configuration; it was overtaken by the Japanese K computer in 2012, but the Tianhe-2 system using 12-core Xeon E5-2692 processors and Xeon Phi cards occupied the first place in both TOP500 lists of 2013.
Based on NetBurst microarchitecture; All models support: MMX, SSE, SSE2, Hyper-Threading All models support dual-processor configurations; Models with no suffix or the A suffix use Socket 603 and a 400 MT/s FSB while models with the B suffix use Socket 604 and a 533 MT/s FSB.
Xeon Platinum supports up to eight sockets; Xeon Gold supports up to four sockets; Xeon Silver and Bronze support up to two sockets; No suffix letter: up to 1.0TB DDR4 per socket-L: Large DDR memory tier support (up to 4.5TB)-M: Medium DDR memory tier support (up to 2.0TB)-N: Network & NFV specialized-R: Refresh (higher performance)
Based on Sandy Bridge microarchitecture.; All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, [1] Intel x8 SDDC, [3] Hyper-threading (except E5-1603, E5-1607, E5-2603, E5-2609 and E5-4617), Turbo Boost (except E5-1603, E5-1607, E5-2603 ...
Die size: Up to 10 cores: 246 mm 2, Up to 15 cores: 306 mm 2, Up to 24 cores: 456 mm 2 Support for up to twelve DIMMs of DDR4 memory per CPU socket. Xeon E5-16xx v4 (uniprocessor)
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