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Architecture Fabrication (nm) Family Release Date Code name Model Group Cores SMT Clock rate () Bus Speed & Type [a] Cache Socket Memory Controller Features L1 L2
a6-3400m: 2011 6/14 4 (4) 1.4 2.3 4× 1mb hd 6520g 320:16:8 400 256 35 am3400ddx43gx a6-3410mx: 1.6 1600 45 am3410hlx43gx a6-3420m: december 7, 2011 1.5 2.4 1333 35 am3420ddx43gx a6-3430mx: 1.7 1600 45 am3430hlx43gx a8-3500m: 2011 6/14 1.5 2.4 hd 6620g 400:20:8 444 355.2 1333 35 am3500ddx43gx a8-3510mx: 1.8 2.5 1600 45 am3510hlx43gx a8-3520m ...
Concrete products are codenamed "Llano": List of AMD accelerated processing units. Llano AMD Fusion ( K10 cores + Redwood -class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017)
The FX 8320 was recognized as a price/performance winner, often matching Intel's i7 2600 at half the cost. [ 15 ] [ 16 ] The Vishera CPUs competed well when compared to similarly priced Intel Ivy Bridge CPUs in multi-core-aware applications and somewhat underperform in overall efficiency and in tasks where most CPU cores were not fully utilized ...
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and ...
Intel Atom Oak Trail 2-way simultaneous multithreading, in-order, burst mode, 512 KB L2 cache Intel Atom Bonnell: 2008 SMT Intel Atom Silvermont: 2013 Out-of-order execution Intel Atom Goldmont: 2016 Multi-core, out-of-order execution, 3-wide superscalar pipeline, L2 cache Intel Atom Goldmont Plus: 2017 Multi-core Intel Atom Tremont: 2019
The Puma Family 16h is a low-power microarchitecture by AMD for its APUs. ... A6 Micro 6500T 1.8 Radeon R4 401 A4 Micro 6400T 1.0 1.6 Radeon R3 350 E1 Micro
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
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