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2. J-B Weld - Wikipedia

   en.wikipedia.org/wiki/J-B_Weld

   J-B Weld is a two-part epoxy adhesive (or filler) that can withstand high-temperature environments. J-B Weld can be used to bond surfaces made from metal, porcelain, ceramic, glass, marble, PVC, ABS, concrete, fiberglass, wood, fabric, or paper. [7] [8] Alcohol should be avoided when cleaning surfaces, as it can degrade the bond. [9]

3. Fusion bonded epoxy coating - Wikipedia

   en.wikipedia.org/wiki/Fusion_bonded_epoxy_coating

   The resin and hardener part together is known as the "Binder". As the name indicates, in Fusion bonded epoxy coatings the resin part is an "epoxy" type resin. “Epoxy” or “Oxirane” structure contains a three membered cyclic ring — one oxygen atom connected to two carbon atoms – in the resin molecule. This part is the most reactive ...

4. Epoxy - Wikipedia

   en.wikipedia.org/wiki/Epoxy

   Two part epoxy coatings were developed for heavy duty service on metal substrates and use less energy than heat-cured powder coatings. These systems provide a tough, protective coating with excellent hardness. One part epoxy coatings are formulated as an emulsion in water, and can be cleaned up without solvents.

5. Araldite - Wikipedia

   en.wikipedia.org/wiki/Araldite

   Highmark Manufacturing uses Araldite epoxy resin in the manufacture of advanced ballistic protection body armour. [6] Schlösser Metallbau, a manufacturer of metal parts for railway carriages, uses Araldite epoxy resin to bond aluminium profiles of cab doorframes on the DBAG Class 423 Siemens Bombardier train. [7]

6. Redux (adhesive) - Wikipedia

   en.wikipedia.org/wiki/Redux_(adhesive)

   Devised at ARL by Dr. Norman de Bruyne and George Newell in 1941 for use in the aircraft industry, the adhesive is used for the bonding of metal-to-metal and metal-to-wood structures. The adhesive system comprises a liquid phenolic resin and a PVF (PolyVinylFormal) thermoplastic powder.

7. Thermal adhesive - Wikipedia

   en.wikipedia.org/wiki/Thermal_adhesive

   It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available. The glue is typically a two-part epoxy resin (usually for paste products) or cyanoacrylate (for tapes). [2] The thermally conductive material can vary including metals, metal oxides, silica or ceramic microspheres.