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APG is an anisotropic material with extremely high in-plane thermal conductivity (1,700 W/m-K at room temperature [2]) and low through-thickness conductivity. Its laminate structure remains stable across a wide temperature range allowing it to be used in a variety of heat transfer applications.
Very high thermal conductivity measurements up to 22,600 w m −1 K −1 were reported by Fenton, E.W., Rogers, J.S. and Woods, S.D. in reference 570 on page 1458, 41, 2026–33, 1963. The data is listed on pages 6 through 8 and graphed on page 1 where Fenton and company are on curves 63 and 64.
Kevlar (para-aramid) [2] is a strong, heat-resistant synthetic fiber, related to other aramids such as Nomex and Technora.Developed by Stephanie Kwolek at DuPont in 1965, [3] [2] [4] the high-strength material was first used commercially in the early 1970s as a replacement for steel in racing tires.
The SI unit of absolute thermal resistance is kelvins per watt (K/W) or the equivalent degrees Celsius per watt (°C/W) – the two are the same since the intervals are equal: ΔT = 1 K = 1 °C. The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
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Thermal conductivity, frequently represented by k, is a property that relates the rate of heat loss per unit area of a material to its rate of change of temperature. Essentially, it is a value that accounts for any property of the material that could change the way it conducts heat. [ 1 ]