Search results
Results from the WOW.Com Content Network
Uranium glass used as lead-in seals in a vacuum capacitor. Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of ...
John Calvin Jureit (July 24, 1918 – September 9, 2005) was an American civil engineer and the inventor of the Gang Nail connector plate, used in building construction specifically for the joining of timber truss joints of roof, floor trusses and prefabricated wall panels. This invention has been widely credited for the boom in affordable ...
Titanium nitride (TiN; sometimes known as tinite) is an extremely hard ceramic material, often used as a physical vapor deposition (PVD) coating on titanium alloys, steel, carbide, and aluminium components to improve the substrate's surface properties.
On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic. [37] Less gold dissolution and more ductile than lead-tin alloys. [12] Good thermal fatigue properties. Pb 60 In 40: 195: 225 [16] Pb: No: In40. Low gold-leaching. Good thermal fatigue properties. Pb ...
The tin whistle is so called because it was mass-produced first in tin-plated steel. [95] [96] Copper cooking vessels such as saucepans and frying pans are frequently lined with a thin plating of tin, by electroplating or by traditional chemical methods, since use of copper cookware with acidic foods can be toxic. [citation needed]
Hot tin-dipping is the process of immersing a part into a bath of pure molten tin at a temperature greater than 450 °F or 232 °C. Tinplate made via hot-dipped tin plating is made by cold rolling steel or iron, pickling to remove any scale, annealing to remove any strain hardening, and then coating it with a thin layer of tin.
The gold-tin intermetallics layer is responsible for poor mechanical reliability of tin-soldered gold-plated surfaces where the gold plating did not completely dissolve in the solder. Two processes play a role in a solder joint formation: interaction between the substrate and molten solder, and solid-state growth of intermetallic compounds.
Gold plated - gold layer thickness greater than or equal to 0.5 micron; Heavy gold plated / Vermeil - gold layer thickness greater than or equal to 2.5 micron; Gold plated silver jewellery can still tarnish as the silver atoms diffuse into the gold layer, causing slow gradual fading of its color and eventually causing tarnishing of the surface ...