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  2. Gallium nitride - Wikipedia

    en.wikipedia.org/wiki/Gallium_nitride

    Gallium nitride (Ga N) is a binary III/V direct bandgap semiconductor commonly used in blue light-emitting diodes since the 1990s. The compound is a very hard material that has a Wurtzite crystal structure .

  3. List of semiconductor materials - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).

  4. Monolithic microwave integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Monolithic_microwave...

    However, they also tend to be more expensive due to smaller wafer sizes and increased material fragility. Silicon germanium (SiGe) is a Si-based compound semiconductor technology offering higher-speed transistors than conventional Si devices but with similar cost advantages. Gallium nitride (GaN) is also an option for MMICs. [1]

  5. Multi-junction solar cell - Wikipedia

    en.wikipedia.org/wiki/Multi-junction_solar_cell

    Indium gallium nitride (InGaN) is a semiconductor material made of a mix of gallium nitride (GaN) and indium nitride (InN). It is a ternary group III–V direct bandgap semiconductor. Its bandgap can be tuned by varying the amount of indium in the alloy from 0.7 eV to 3.4 eV, thus making it an ideal material for solar cells. [ 35 ]

  6. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    The step up to 300 mm required major changes, with fully automated factories using 300 mm wafers versus barely automated factories for the 200 mm wafers, partly because a FOUP for 300 mm wafers weighs about 7.5 kilograms [48] when loaded with 25 300 mm wafers where a SMIF weighs about 4.8 kilograms [49] [50] [18] when loaded with 25 200 mm ...

  7. High-electron-mobility transistor - Wikipedia

    en.wikipedia.org/wiki/High-electron-mobility...

    The invention of the high-electron-mobility transistor (HEMT) is usually attributed to physicist Takashi Mimura (三村 高志), while working at Fujitsu in Japan. [4] The basis for the HEMT was the GaAs (gallium arsenide) MOSFET (metal–oxide–semiconductor field-effect transistor), which Mimura had been researching as an alternative to the standard silicon (Si) MOSFET since 1977.

  8. Charge carrier density - Wikipedia

    en.wikipedia.org/wiki/Charge_carrier_density

    In this case, the carrier density (in this context, also called the free electron density) can be estimated by: [5] n = N A Z ρ m m a {\displaystyle n={\frac {N_{\text{A}}Z\rho _{m}}{m_{a}}}} Where N A {\displaystyle N_{\text{A}}} is the Avogadro constant , Z is the number of valence electrons , ρ m {\displaystyle \rho _{m}} is the density of ...

  9. Aluminium gallium indium phosphide - Wikipedia

    en.wikipedia.org/wiki/Aluminium_gallium_indium...

    The use of aluminium gallium indium phosphide with high aluminium content, in a five junction structure, can lead to solar cells with maximum theoretical efficiencies above 40%. [ 1 ] AlGaInP is frequently used in LEDs for lighting systems, along with indium gallium nitride (InGaN).