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The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
Shannon–Weaver model of communication [86] The Shannon–Weaver model is another early and influential model of communication. [10] [32] [87] It is a linear transmission model that was published in 1948 and describes communication as the interaction of five basic components: a source, a transmitter, a channel, a receiver, and a destination.
For example, "SN5400N" signifies that the part is a 7400-series IC probably manufactured by Texas Instruments ("SN" originally meaning "Semiconductor Network" [104]) using commercial processing, is of the military temperature rating ("54"), and is of the TTL family (absence of a family designator), its function being the quad 2-input NAND gate ...
In computer science, interprocess communication (IPC) is the sharing of data between running processes in a computer system. Mechanisms for IPC may be provided by an operating system . Applications which use IPC are often categorized as clients and servers , where the client requests data and the server responds to client requests. [ 1 ]
Four PCI Express bus card slots (from top to second from bottom: ×4, ×16, ×1 and ×16), compared to a 32-bit conventional PCI bus card slot (very bottom). In computer architecture, a bus (historically also called a data highway [1] or databus) is a communication system that transfers data between components inside a computer or between computers. [2]
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (metal oxide semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunications technologies.
Intel FWIXP422BB. A network processor is an integrated circuit which has a feature set specifically targeted at the networking application domain.. Network processors are typically software programmable devices and would have generic characteristics similar to general purpose central processing units that are commonly used in many different types of equipment and products.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]