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For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Pure metal. Rarely used due to high melting point. Used for joining molybdenum and tungsten for high-temperature applications. 100: Ti 100: pure 1670 – Pure metal. 100: Fe 40 Ni 38 B 18 Mo 4 – Amorphous metal. For brazing and soft magnetic applications. Crystallization at 410 °C. Maximum service temperature 125 °C. [97] 4: 40: 38: 18: Ti ...
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.
"Hard soldering" or "silver soldering" is used to join precious and semi-precious metals such as gold, silver, brass, and copper. The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint. Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F).
Good high-temperature performance, good corrosion resistance in moderately aggressive environments. Often used for stainless steels and heat-resistant alloys. Embrittled with sulfur and some lower-melting point metals, e.g. zinc. Boron, phosphorus, silicon and carbon lower melting point and rapidly diffuse to base metals.
Additionally, for a given fixed homologous temperature, two materials with different melting points would have similar diffusion-dependent deformation behaviour. For example, solder (T mp = 456 K) at 115 °C would have comparable mechanical properties to copper (T mp = 1358 K) at 881 °C, because they would both be at 0.85T mp despite being at ...
Materials such as solder require a relatively low melting point so that when heat is applied to a joint, the solder will melt before the materials being soldered together melt, i.e. high fusibility. On the other hand, firebricks used for furnace linings only melt at very high temperatures (and then they retract, or decompose, or become fracture ...
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